The analysis of differences for GB 4706.1 section 19.11.4 chapter with the latest IEC standardsXIAO Peng, SU Tao, LI Yan32-33
The analysis and application of the electrical contacts reliability of low voltage electrical mechanical switchWU Bin38-40
An investigation on the use of thermal calibration deviceLIU Huilin, TANG Zheng, CHEN Xueqing, TONG Lei46-47
Using the relationship forward voltage of diode and the junction temperature is used to evaluate the die bonding reliability of high power semiconductor devicesYUAN Weigang, ZHAO Chengxian, MU Yunhua, FAN Qingqing, DENG Tao, ZHENG Jincan50-53
Research on performance of the R290 cooling system in large volume cabinet freezerZHANG Sai, LI Yang, QING Zengwu, ZHANG Huawei54-56
