Study progress of the technology of copperalloy platingby che mical displacement

doi:10.3969/j.issn.1004-1478.2001.01.016

Home>Articles>Study progress of the technology of copperalloy platingby che mical displacement

DOI: 10.3969/j.issn.1004-1478.2001.01.016

Study progress of the technology of copperalloy platingby che mical displacement

Abstract：On the basis of our recent study and progress about copperalloy plating , a theory of electrochemical deposition by chemical displaceplating is provid ed. In the presence of proper additives, not only can the deposition velocity of displaceplating and electrode potential be controlled, also the threedimens ion crystal and loose deposition can be avoided. Thus the cathodic process of displacement plating can succeed as normal electrodeposit. Furthermore, high st reng th displaceplating layer can be made. The technology is ideal and satisfactory to plate copper for CO2 gas welding wire, tyrewire, othe r wir es and tinbronze because of its high speed deposition, simple process, higher composition power and rustproof ability.

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Publication Date：2001-01-01

Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)

Pages：3( 55-57 )

Journal of Zhengzhou Institute of Light Industry

ISTIC

ISSN：1004-1478

Year, Vol.(Issue)：2001,16(1)