Review on the Effect of Nanoparticles on the Microstructure and Performance of Flip Chip Solder Joints
ZHANG Cheng
ZHAI Xinmeng
CHEN Yue
LI Yuefeng
ZOU Jun
SHI Mingming
YANG Bobo
SU Xiaofeng
YANG Xuezhou
QIAN Qi
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Publication Date：2022-08-28
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：11( 82-92 )