Research Progress on LED Thermal Analytical Test and Thermal Management Technology
LIU Bo
ZHENG Wei
LI Haiyang
ZHU Xinyun
MA Chao
Abstract：With the increase of integration level and power of LED, heat dissipation has been the bottleneck for LED industry development. The heat generation mechanisms and suppression techniques were introduced considering non-radiative recombination, current crowded, current overflow and light confinement. The LED junction temperature can be measured by different methods,such as contact method (electrical test method) and non-contact method (micro-IR thermography, peak wavelength, and blue/white methods). These methods were reviewed and analyzed based on their characteristics. Key algorithms were presented for thermal structure functions. Finally, the heat transfer enhancement has been discussed according to thermal resistances due to interface,spreading,and component-to-ambient. The trend for LED thermal management and thermal analytical test technology was also analyzed.
Keywords：LEDthermal testheat transfer enhancementelectrical test methodstructure functions
Publication Date：2018-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：7( 28-34 )