The Optical and Color Consistency and Optimal Design of Spectrum Power Distribution for LED White Chips
LUO Liangliang
FAN Jiajie
JING Zhou
QIAN Cheng
FAN Xuejun
ZHANG Guoqi
Abstract：Based on the wafer level chip scale packaging technology,white light-emitting diode (LED) chip,with advantages on high efficacy,low thermal resistance and small size,has been considered as one of the most attractive technologies to manufacture the high quality full spectrum LED light sources and modules in the future.In this paper,the white LED chips with five illumination surfaces were prepared,then the influences of packaging materials and structure size on their optical and color consistency was investigated based on the spectrum power distribution analysis.The results indicate that:①the thickness of phosphor layer and the power output (PO) of LED chip have significant influence on the color consistency of LED white chips.Therefore,the precision of molding process and consistency of LED blue chip's PO should be strictly controlled during the manufacture;②he luminous efficacy of LED white chip was linearly dependent on its luminous efficacy of radiation (LER) and the photoelectric conversion efficiency of used LED blue chip (ΦB).The lower the correlated color temperature (CCT),the lower the coefficient of linear correlation.Finally,we developed an efficient and practical process to design phosphor mixture by optimizing the spectral power distribution,which can provide guidance on LED white chip design.
Keywords：LEDwhite chipwafer level chip scale packagespectral power distributionoptical and color consistency
Publication Date：2018-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：7( 1-6,33 )