Effects of Voiding Percentages in Devices Solder Layer on LED Back Light Unit Thermal Resistance
LIU Zhihui
CHAI Guangyue
YAN Xingtao
LIU Qi
LUO Jiansheng
Keywords：LED back light unitsolder layervoiding percentagesthermal resistance
Publication Date：2016-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：6( 98-103 )