Research Status and Development Trends of LED Packaging
Tang Kun
Zhuo Ningze
Shi Fenghua
Xing Haidong
Liu Guangxi
Wang Haibo
Abstract：With the development of efficiency , high power , high reliability and low cost , LED packaging technology becomes more important , while facing enormous challenges .In the process of packaging , materials and structures are key factors in heat dissipation and light extraction .This paper mainly described research status and development trends of LED packaging from materials ( chips , substrates , thermal interface materials, phosphors) and structures (Lamp, Surface Mounted Devices (SMD), Chip on Board (CoB), Remote phosphor (RP)).
Keywords：LEDpackagingmaterialstructure
Publication Date：2014-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 26-30 )