Research on Die Bonding Packaging Technology of High Power Flip-chip LEDYANG Ning, WANG Guanyu, HUANG Peiwen, XIE Jianxing14-19
The Effect of Flux on LED in Lead-Free Solder PasteZHOU Peng, YANG Lu, TANG Xiaoting, CHEN Yunfa23-27
Useful Luminous Flux Measurement Method for Directional Lamps in C-γ Coordinate SystemZHENG Zhilei33-36
Electromagnetic Compatibility Test and Analysis of LED Surgical Shadowless LampKONG Qiangqiang, SONG Qingjun, YAN Kai, ZHANG Zhihao, YAN Tingwei37-41
