Analysis of Key Factors Affecting the Reliability of Flip-Chip LED Packaging
WEN Jianhui
Abstract：Flip-chip LEDs have advantages such as no gold wire bonding,excellent heat dissipation,high light extraction efficiency,and high packaging density,making them core components of high-end light sources.Their reliability is affected by materials,processes,structures,and environments,and they are prone to problems such as light decay.This paper systematically explains their packaging structure and working mechanism,clarifies core reliability indicators such as luminous flux maintenance rate and junction temperature thermal resistance,as well as common failure modes;analyzes the mechanism and evaluation methods of the four key influencing factors,and proposes improvement measures,providing references for related research and applications.
Keywords：flip-chip LEDpackaging reliabilitythermal design
Publication Date：2025-12-25
Online Publishing Date：2026-01-08(First online date of this platform, not the publication date of the document)
Pages：3( 76-78 )