Design and Layout Optimization of Power Supply Solder Joints for High-Reliability Lighting
ZHANG Wenhua
HAN Jianzhuang
LIU Gongsheng
WEN Yijin
YANG Gang
Abstract：This study addresses solder joint failure in LED/OLED lighting systems by analyzing three main failure modes:thermal cycling,electromigration,and mechanical vibration,identifying key factors affecting solder joint reliability.It establishes material selection criteria based on thermal expansion matching,proposes an optimized geometric parameter with a height-to-diameter ratio(H/D)of 0.6～0.8,and develops a layout strategy with thermal-sensitive component zoning and current balancing.Finite element simulation shows the optimized design reduces peak solder joint temperature by 26.5%and stress by 41%.An industrial case study confirms the approach increases the MTBF of tunnel lighting power modules from 3 to 8.4 years,offering a practical method for high-reliability lighting system design.
Keywords：lighting powersolder joint reliabilitythermal stress optimizationstaggered layout designelectromigration
Publication Date：2025-09-25
Online Publishing Date：2025-10-14(First online date of this platform, not the publication date of the document)
Pages：3( 79-81 )