Research on Polishing Technology of Mini LED Chip Sapphire Substrate
LIU Youzhi
Abstract：With the use of LED in HD display,Mini LED appears,the chip size is small,and the chip thickness is further required to be thinner,the thickness after thinning is 50～60 μm,and the ensuing warping problem becomes a difficult problem in manufacturing.This process study by adjusting the diamond polishing liquid particle size of rough polishing process and matching CMP process pressure.The test results show that the coarse polishing process diamond polishing liquid particle size is 3 μm,CMP process parameters,pressure 50 kg,footwall speed 50 r/min time 15～20 min,the best effect.
Keywords：50～60 μmthicknesswarpingdiamond slurryparameter
Publication Date：2024-11-25
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：4( 49-52 )