Overview of the Influence of Soldering Process on the Reliability of Flip Chip LED
NIE Chengcheng
Keywords:flip chip LEDwelding processvoidsreliability
Publication Date:2023-02-25
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:8( 5-12 )
China Light & Lighting

China Light & Lighting

ISSN:1002-6150
Year, Vol.(Issue):2023,(2)