Experiment study on adhesion characteristics between cohesive soil and metal plate under slurry immersion
MAO Jiahua
LI Shuchen
YANG Chen
PAN Juntao
WANG Yingying
ZHOU Peng
Abstract:Elucidating the adhesion mechanisms between cohesive soil and metal under slurry im-mersion is crucial for preventing clogging and cake formation on cutterhead in slurry shield tunnel-ing.Based on the response surface methodology,an experimental study was conducted to investi-gate the adhesive stress between cohesive soil and metal,considering three factors:bentonite con-tent ratio,initial consistency index,and slurry immersion time.A quadratic polynomial regression model for adhesive stress was established,and the variation patterns of adhesive stress under slurry immersion were analyzed.The results show that the initial consistency index of cohesive soil has the most significant influence on adhesive stress,with notable interactive effects between bentonite con-tent ratio and initial consistency index,as well as between initial consistency index and immersion time.The adhesive stress generally decreases with prolonged immersion time.Under short-term immersion,cohesive strata with lower initial water content are more prone to causing clogging and cake formation on cutterhead and other equipment.In contrast,under long-term immersion,cohe-sive strata with lower initial water content and higher bentonite content exhibit a more rapid reduc-tion in peak adhesive stress.The adhesion behavior at the cohesive soil-metal interface under slurry immersion is not solely determined by the water content of the soil.The findings provide insights for risk assessment and prevention of cutterhead clogging in slurry shield tunneling in cohesive strata.
Keywords:clay soilslurry shieldslurryadhesionwater content
Publication Date:2026-01-30
Online Publishing Date:2026-01-28(First online date of this platform, not the publication date of the document)
Pages:12( 232-243 )
Journal of China University of Mining & Technology

Journal of China University of Mining & Technology

ISTICPKUEICSCD
ISSN:1000-1964
Year, Vol.(Issue):2026,55(1)