Research on the design and preparation of personalized finger orthosis based on reverse engineering and 3D printing technology
HUANG Mengyang
LIN Lili
ZHU Chaoting
HU Bin
Abstract：In this study,reverse engineering combined with fused deposition modeling(FDM)3D printing technology was adopted to conduct personalized manufacturing of finger orthoses.High-precision finger STL data was obtained through 3D scanner and Real Viewer software.The hollow structure design of the finger orthosis model was carried out using the reverse modeling software Meshmixer.The 3D printing preparation of orthoses was completed using polylactic acid material.The"3D scanning-data processing-model optimization-3D printing-performance testing"closed-loop technical path was constructed.Experimental tests showed that the finger orthosis with a 2 mm wall thickness had a hardness of 82.3 HD in the main part,78.5 HD in the hollow area,a tensile strength of 52.29 MPa,and an elongation at break of 5.19%,which met the clinical mechanical requirements.Under a negative pressure environment of-0.085 MPa,its length contraction was(0.12±0.03)mm and width expansion was(0.08±0.02)mm,both of which were smaller than the clinical allowable errors.The electrostatic interference test showed that the static voltage of the orthosis was 0.22 kV,which was lower than the human electrostatic perception threshold.The constructed closed-loop technical path provides a feasible technical solution for the personalized customization of finger orthoses,and has important practical value for improving the clinical adaptability of orthoses.
Keywords：reverse engineeringFDMfinger orthosiselectrostatic interference
Publication Date：2025-10-28
Online Publishing Date：2025-12-08(First online date of this platform, not the publication date of the document)
Pages：5( 5-9 )