Comparison of the adhesive strength of self etching adhesives at different dentin thickness
HUANG Lan-lan
YI Hong
LIU Xiao-min
Abstract:AIM:To evaluate the adhesive strength of the self etching adhesives.METHODS:24 freshly ex-tracted premolars were selected,and the crown enamel was removed. The superficial dentin was exposed and the teeth were divided into 3 groups randomly(n=8). The dentin surfaces were bonded with:OptiBond Versa(OV),Clearfil SE Bond(SE) and G Bond (GB) according to the manufacturers′ directions respectively. Then P60 composite build-up was made for all samples. After storage for 24 hours in water at 37 ℃. cylindrical specimens with an area of 1.0 mm2 perpendicular to the dentin surface of the samples were prepared using a slow-speed slicer. The remaining dentin thick-ness(RDT) was measured to assess the superficial dentin group (RDT≥3 mm) and the deep dentin group (RDT≤2 mm).Microtensile bond strength measurements were evaluated. Fractured specimens were examined with a stereo-microscope to determine the mode of failure. RESULTS:The bond strength(MPa) of OV,SE and(GB) in shallow lany-er of dentin was 44.96 ± 2.05,29.40 ± 1.77 and 16.38 ± 1.34(P<0.05),in deep layer 32.60 ± 1.58,22.79 ± 1.19 and 11.98 ± 0.91(P<0.05),respectively. The bond strength of the 3 self etching adhesives in the shallow layer was higher than that in the deep layer (P<0.05). No cohesive failure was observed in either superficial or deep dentin. Most of the failure was adhesive failure. CONCLUSION:The bond stength OV is the OV is the highest for dentine fol-lowed by SE and GB. The bonding strength of the 3 adhesives for shallow dentin were higher than that for deep dentin.
Keywords:remaining dentin thicknessmicrotensile bond strengthself etching adhesive
Publication Date:2018-01-01
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:5( 153-156,142 )
Chinese Journal of Conservative Dentistry

Chinese Journal of Conservative Dentistry

PKUISTIC
ISSN:1005-2593
Year, Vol.(Issue):2018,28(3)