Preparation and performance analysis of organically bonded flame retardant thermosetting composite insulation boards
LI Jie
WU Chunyan
ZHANG Guoyong
DONG Ze
WEI Wei
ZHU Jianming
CHEN Xianjin
Abstract：In this paper,the organic bonded flame-retardant thermosetting composite thermal insulation board was prepared by mold pressing,standing pressing,maintaining pressure and demolding,and thermal reaction after compound modification of the organ-ic bonding system with expanded perlite particles.The influences of the density of expanded perlite particles,the molding pressure ratio and the amount of glue used on the mechanical properties and thermal conductivity of the thermosetting composite thermal insulation board were studied and analyzed,and the microstructure analysis of the experimental results was carried out.The results show that the compound modified flame-retardant gluing system could effectively bond the loose expanded perlite particles to make them compact.The prepared thermosetting composite thermal insulation board has low density,excellent strength performance(reaching 0.31 MPa),low thermal conductivity(0.054 W/m·K),and also has Class A non-combustible performance.It has a promis-ing prospect for application in the external thermal insulation of building exteriors.
Keywords：organic bondingthermosetting compositeflame-suppressionthermal insulation boardthermal conductionmechani-cal properties
Publication Date：2025-01-24
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)