Effect of extrusion temperature on microstructure evolution of high-purity copper
BAO Lei
WANG Xuan
LE Qi-chi
LUO Jun-feng
ZENG Hao
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Publication Date:2020-07-25
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:5( 402-406 )
Journal of Shenyang University of Technology

Journal of Shenyang University of Technology

ISTICPKU
ISSN:1000-1646
Year, Vol.(Issue):2020,42(4)