Effect of technological parameters on interface bonding of copper-aluminum-copper composite plate
HUANG Hong-jun
LI Xue-qi
ZUO Xiao-jiao
ZHENG Wen-tao
YUAN Xiao-guang
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Publication Date：2020-01-25
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 47-51 )