Simulation of solidification process of amorphous alloy and interfacial heat transfer relationship
QIU Ke-qiang
XIE Ting-ju
ZHANG Wei
REN Ying-lei
YANG Gui-xing
Abstract：In order to accurately simulate the temperature field of bulk amorphous alloy in the solidification process, the temperature field data of amorphous alloy during the solidification with the pouring temperature of 840℃ were collected. According to the interfacial heat transfer model and heat conservation law, the interfacial heat transfer coefficient relationship between the liquid-solid phases and copper mold was established, and the simulation of temperature field in the solidification process of amorphous alloy was realized. The results show that the interfacial heat transfer coefficient between the alloy and copper mold increases with increasing the temperature. The simulated value obtained from the cooling curves of the alloy melt is basically in agreement with the measured value. The deviation of both simulated and measured values is small when the solidification temperature reduces to about 500 ℃. The interfacial heat transfer model in combination with the measured temperature field can be used to characterize the interfacial heat transfer relationship of amorphous alloy during the solidification.
Keywords：amorphous alloyinterfacial heat transfer coefficientthermophysical parameterrapid solidificationnumerical simulationtemperature fieldcooling ratecopper mold
Publication Date：2017-09-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 496-500 )