Simulation analysis for influence of fracture occurrence on thermal conductivity under thermal-solid coupling
QU Cheng-kun
ZHOU Hui
REN Zhen-qun
CHENG Wen-wu
Abstract：In order to study the influence of fracture occurrence on the thermal conductivity, the relationship between the fracture occurrence and thermal conductivity was established through stimulating the cubic law.With the multi-field coupling analysis software Comsol Multiphysics, four different fracture geometry models were established.After the thermal boundary conditions were added, the thermal conductivities of whole model under different fracture occurrences were obtained.The results show that the fracture has obvious blocking effect on the thermal conduction.When the fracture aperture increases, the thermal conductivities of whole model obviously decrease in the form of power function.With increasing the fracture angle, the thermal conductivities will linearly increase.With decreasing the fracture number and increasing the fracture surface roughness, the thermal conductivities show an increasing trend.
Keywords：thermal-solid couplingdisposal of high-level nuclear wastefracturesurface roughnesscubic lawthermal conductivitymulti-field coupling analysis softwarenumerical simulation
Publication Date：2017-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：6( 219-224 )