Numerical simulation for temperature effect of external thermal insulation system with XPS board
YANG Lu
KONG Fang-yun
WANG Wei
Abstract：To study the change of thermal stress of XPS board thermal insulation material in different seasons, a theoretical model was proposed with both Fourier equation and law of energy conservation based on the calculation of temperature field of typical external thermal insulation wall.Three construction schemes of external thermal insulation system with XPS board were selected and the numerical simulation was carried out. In the scheme 1,the 30 mm powder polystyrene particles stuck to XPS board.In the scheme 2,the 10 mm powder polystyrene particles stuck to XPS board.In the scheme 3,the thin plaster for the external wall was performed.The mechanical behavior of wall material in each layer in the external thermal insulation system was analyzed.The results show that whole wall subjects to compressive stress in summer,the stress for the coating layer changes from -0.34 MPa to -0.02 MPa within a day,and the expansion from the wall is easy to occur.Whole wall subjects to the tensile stress in winter,the stress changes from 0.12 MPa to 0.26 MPa, and the cracking risk is relatively large.The scheme 1 has the minimum temperature gradient and the best thermal insulation effect.Therefore,the scheme 1 is better than both scheme 2 and scheme 3.
Keywords：external thermal insulation systemtemperature stresstemperature fieldXPS insulation boardpowder polystyrene particlecohesive elementfinite element analysisconvection coefficient
Publication Date：2014-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 701-705 )