Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder
WANG Zong-jie
LU Lin
WANG Min
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Publication Date：2005-07-02
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：4( 377-380 )