P roduction T echnology O ptimization of F ood G rade U ltra-thin E lectroplating T in S ubstrate
REN Laisuo
HOU Yuanxin
LI Chuanjun
ZHAO Zhigang
Abstract：According to the quality requirements of food grade ultra-thin electroplating tin substrates, by optimizing the pickling parameters, physiochemical index of emulsion, the temperature and concentration of alkali liquor and electrolyte and the conductivity of rinsing water, the surface quality of the products was improved. By studying the relationship between the traversing positions of intermediate roll of HC six-roll mill and the shape and adjusting the amount of work roll bending roll, the shape quality was improved. All-hydrogen strong cyclic bright batch annealing technology was adopted and by optimizing the annealing process, the physical properties were insured. Therefore, Taishan Steel successfully developed the food grade ultra-thin electroplating tin substrates. The products have high surface precision (FC), the unevenness is less than 2 mm, the deviation of width is within 0-3 mm, the deviation of thickness is within-0.02-0 mm and the hardness meets the T3 requirements.
Keywords：ultra-thin electroplating tin substrateproduct developmentsurface qualityflatnessproperty
Publication Date：2013-11-01
Online Publishing Date：2026-05-22(First online date of this platform, not the publication date of the document)
Pages：5( 10-13,16 )