Optimizing design of sealing methods of cooling module at thermal shock condition
CHENG Jingmin
LI Jianwen
WANG Hongzhong
Wang Lei
WANG Huihui
LI Hanhan
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Publication Date：2020-12-28
Online Publishing Date：2026-05-22(First online date of this platform, not the publication date of the document)
Pages：7( 50-56 )