The Process Resarch of Electroless Copper Plating on Polyester Fabrics Using Sodium Hypophosphite as Reductant & Cu/TiO2 Compound Plating

doi:10.3969/j.issn.1009-3028.2008.03.004

Home>Articles>The Process Resarch of Electroless Copper Plating on Polyester Fabrics Using Sodium Hypophosphite as Reductant & Cu/TiO2 Compound Plating

DOI: 10.3969/j.issn.1009-3028.2008.03.004

The Process Resarch of Electroless Copper Plating on Polyester Fabrics Using Sodium Hypophosphite as Reductant & Cu/TiO2 Compound Plating

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Publication Date：2008-01-01

Online Publishing Date：2026-05-22(First online date of this platform, not the publication date of the document)

Pages：4( 9-12 )

SHANDONG TEXTILE SCIENCE & TECHNOLOGY

ISSN：1009-3028

Year, Vol.(Issue)：2008,49(3)