Microstructure and Properties of Electroless Ni-P/Sn2.5Ag0.7Cu0.1 RE Micro-solder Joints during Thermal Aging Process
ZHANG Keke
HOU Ruiqing
ZHAO Wenjia
ZHANG Haizhou
ZHANG Chao
Abstract：To investigate the microstructure and properties of lead-free solder joints with electroless Ni-P plating under the action of thermal aging,an Ni-P layer was prepared on the surface of T2 pure copper by chemical plating method.The lead-free solder joints with electroless Ni-P plating were preparedby using the Sn2.5Ag0.7Cu0.1RE solder through the reflow soldering method.The results show that the initial microstructure of the IMC at the Ni-P/solder transition area of the micro-solder joint is a"blocky"(Ni,Cu)3Sn4,with an average thickness of 1.5 μm.During the aging process at 180 ℃ for 100 h,the morphology of the(Ni,Cu)3 Sn4 IMC at the Ni-P/solder transition area of the micro-solder joint gradually changed to a"lamellar"shape and thickened to 3.3 µm.The shear fracture location of the micro-solder joint shifted from the solder to the Ni-Sn-P/IMC interface,and the fracture mode changed from ductile fracture to brittle fracture.Correspondingly,the push-pull force of the micro-solder joint decreased by 11.9％from the initial 16 N.
Keywords：electroless Ni-Pmicro-solder jointthermal aginginterfacial IMCfracture
Publication Date：2024-10-25
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：9( 41-49 )