Effect of Aging on Microstructure and Shear Strength of Sn57Bi0.5Ag/Cu Solder Joint
QIN Chang-Jiang
HUANG Jin-Liang
ZHANG Ke-Ke
WANG Yao-Li
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Publication Date：2006-05-02
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：4( 5-7,11 )