The Analysis of Bonding Interface Microstructure of Copper/Steel Compound Plate by Explosion Welding
XIAO Hong-Bin
LI Qian
ZHU Yao-Min
LI Yan
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Publication Date:2000-09-30
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:4( 27-30 )
JOURNAL OF LUOYANG INSTITUTE OF TECHNOLOGY

JOURNAL OF LUOYANG INSTITUTE OF TECHNOLOGY

ISTICPKU
ISSN:1672-6871
Year, Vol.(Issue):2000,21(4)