Research progress on performance improvement and interface control optimization of SiCp/Cu matrix composites
ZHANG Yunlong
WANG Junqing
ZHANG Weiyi
WANG Weie
REN Xiaoxue
LI Chenghai
ZHAI Ziyu
LIU Debao
Abstract：With the continuous improvement of comprehensive performance of materials requirements in fields such as advanced manufacturing,electronic packaging,and thermal management,traditional copper and its alloys are increasingly facing limitations in strength,wear resistance,and electrical and thermal conductivity.Silicon carbide particle-reinforced copper matrix composites(SiCp/Cu)have attracted exten-sive attention due to their excellent mechanical,electrical,and thermal properties.This paper provides a systematic review of the performance enhancement mechanisms of SiCp/Cu composites in terms of wear re-sistance,electrical conductivity,thermal conductivity,and corrosion resistance,focusing on the optimiza-tion of compositional design parameters such as SiC particle size,content,and distribution.Moreover,the interfacial control strategies through Cu matrix microalloying and surface modification of SiC particles,as well as the concept of multiphase synergistic reinforcement,are discussed.This study aims to provide a valuable reference for the design and development of high-performance SiCp/Cu matrix composites.
Keywords：SiCp/Cu-based compositesinterface controlperformance improvement mechanismmaterial design optimization
Publication Date：2026-02-25
Online Publishing Date：2026-08-28(First online date of this platform, not the publication date of the document)
Pages：9( 75-83 )