Precision visual inspection algorithms for high-density flexible integrated circuit packaging substrates
HU Yue-ming
HUANG Dan
YU Yong-xing
LUO Jia-xiang
Abstract：Flexible integrated circuit(IC)packaging substrates with a high density are essential for holding electronic components.Strict quality control is required during their manufacturing operations,which include developing and etching.For the purpose of acquiring images and ensuring the quality control of flexible IC packaging substrates,an industrial camera and metallographic microscope are integrated into an imaging vision inspection system.To address the challenges of narrow field of vision and defocus vulnerability in microscopic imaging,a fast autofocus algorithm for local textures in ternary mode based on median value is proposed.Furthermore,to tackle the uneven distribution of oxidation defects on flexible IC packaging under high magnification,a high-precision surface oxidation distribution feature detection model based on dynamic curve evolution is developed,incorporating differential geometry and utilizing geometric features like curvature.Experimental research,both qualitative and quantitative,confirms the superior performance of both algorithms in terms of speed and accuracy.
Keywords：flexible IC packaging substratequality controlvisual inspection of appearanceautofocus detection algo-rithmdifferential geometric
Publication Date：2024-07-28
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：9( 1255-1263 )