Research on Single Event Crosstalk with Process Variations of Interconnect Lines
LIU Baojun
YONG Xiaoju
ZHANG Shuang
CHEN Minghua
Abstract：To characterize the effect of process variation of interconnect lines on single event crosstalk(SEC),Based on the equivalent RLC model for the interconnect line and the equivalent circuit for single e-vent transient(SET),the ultimate process corner parameters of single event crosstalk(SEC)considera-tion with the process variations of the line are achieved by analyzing extreme difference and variance on the results of the designed orthogonal experimental,and then the mechanism of the effects of technology node,ion energy,length of line on the ultimate process corner of SEC are also discussed.The results show that under condition of the combined effects of the coupling effects between the interconnect lines and the pulse propagation characteristics,and 45 nm above technology node,when the interconnect structure parameter fluctuates±10％,the variation range of SEC is greater than 20％,and the relative variation in-creases with the increase of the current amplitude.Whereas there is no significant difference with the in-crease of the interconnect length.Under condition of 45 nm below technology node,although the voltage peak and noise area of SEC increase significantly,there is a decrease in the influence of interconnect process fluctuation on SEC,and the fluctuation of SEC increases with the increase of interconnect length.
Keywords：process variationssingle event transient(SET)crosstalk effectultimate process corner
Publication Date：2025-06-25
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：7( 79-85 )