Evaluation and Prospect of Thermal Fatigue on Lead free Solder Joints in Electronic Equipment
JING Bo
HU Jiaxing
HUANG Yifeng
TANG Wei
SHENG Zengjin
DONG Jiayan
Abstract：Thermal fatigue is a maj or source of failure of solder j oints in surface mount electronic compo-nents.Through analyzing and summarizing the lead?free solder j oint thermal reliability at home and a-broad,this paper emphatically expounds the influence of the solder Ag content,thermal cycle parameters and solder j oint microstructure on the thermal reliability of lead?free solder j oints.Finally,the paper analy-zes the challenges and the developing trend of the lead?free solder j oint thermal reliability.The hotspot and challenges in the future research by microstructure analysis and modeling,the influence of thermal load a-nalysis and the construction of physical failure model of solder joint,etc.are going to be researched fur-ther.
Keywords：lead?free solder jointAg contentthermal cycleAg3 Cu precipitatesrecrystallization
Publication Date：2016-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：6( 35-40 )