Numerical Simulation of Thermal State in the Environment of Circuit Board of Multi Components
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Publication Date:2001-01-01
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:4( 40-43 )
JOURNAL OF AIR FORCE ENGINEERING UNIVERSITY

JOURNAL OF AIR FORCE ENGINEERING UNIVERSITY

PKUISTIC
ISSN:1009-3516
Year, Vol.(Issue):2001,2(3)