Flip-chip interconnect technology in optoelectronics device packaging
GUAN Rong-feng
ZHAO Jun-liang
LIU Sheng
ZHANG Hong-hai
HUANG De-xiu
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Publication Date：2005-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 50-54 )