Molecular Dynamics Simulation of Temperature-Influenced Epoxy/C-S-H Interfacial Bonding Properties
YANG Qingrui
JIN Zuquan
WANG Pan
HOU Dongshuai
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Publication Date:2022-10-28
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:6( 1086-1091 )
Journal of Building Materials

Journal of Building Materials

ISTICPKUEICSCD
ISSN:1007-9629
Year, Vol.(Issue):2022,25(10)