Experimental Study on Bond-Slip Behavior of Bamboo-Thermal Insulation Material Interface
TIAN Limin
HAO Jiping
KOU Yuefeng
XU Kun
ZHAO Qiuli
Abstract：In order to investigate the distribution of bonding stress and bond-slip between bamboo and thermal insulation material interfacial,twelve specimens weremade to perform the pull-out test.The failure mode,bond mechanism and the influence factors of bond strength were analyzed.The results show that the bonding force between bamboo and thermal insulation material is composed by chemical bonding force,mechanical interaction and friction.Through establishing two typical bond-slip curves,the failure process can be divided into four stages:no sliding segment,sliding segment,friction segment,after sliding segment.The more combined length between bamboo and thermal insulation material,the rougher of bamboo surface and the smaller of bamboo diameter,the greater the bond strength is.Thereinto,the influence of the roughness is the largest because it changes rule of bond strength.Some methods to enhance bond-slip behavior of bamboo-thermal insulation material interface is given:making the surface of bamboo rough,choosing the small diameter bamboo,and combining the thermal insulation material and bamboo completely.
Keywords：thermal insulation materialbamboointerfacial bond-slip behaviorpull-out testinterfacial bond mechanism
Publication Date：2018-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：6( 65-70 )