STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING
LIANG Ying
HUANG ChunYue
YIN Rui
HUANG Wei
LI TianMing
ZHAO HongWang
Keywords：Microelectronic package Ball grid array solder joint Three point bending load Finite element analysis Stress and strain
Publication Date：2016-01-01
Online Publishing Date：2026-09-12(First online date of this platform, not the publication date of the document)