RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW
LI Lun
LI ShuJuan
TANG AoFei
LI Yan
Keywords:SiC mono-crystal waferDiamond wire sawCutting technology with wire sawPresent researching status
Publication Date:2015-01-01
Online Publishing Date:2026-09-12(First online date of this platform, not the publication date of the document)
Journal of Mechanical Strength

Journal of Mechanical Strength

PKUISTIC
ISSN:1001-9669
Year, Vol.(Issue):2015,37(5)