EFFECT OF AGING ON MICROSTRUCTURE AND TENSILE PROPERTIES OF Sn-3.8Ag-0.7Cu/Cu SOLDER JOINT
LI XiaoYan
YANG XiaoHua
DUI WeiZhen
WU BenShen
YAN YongChang
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Publication Date：2008-01-01
Online Publishing Date：2026-09-12(First online date of this platform, not the publication date of the document)
Pages：5( 24-28 )