THERMO-FATIGUE LIFE PREDICTION METHODOLOGIES FOR SnAgCu SOLDER JOINTS IN FLIP-CHIP ASSEMBLIES
LI XiaoYan
WANG ZhiSheng
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Publication Date：2006-09-18
Online Publishing Date：2026-09-12(First online date of this platform, not the publication date of the document)
Pages：6( 893-898 )