Study on Thermal Reliability and Failure Analysis Based on MCU ChipsWANG Dun, YAN Chenkan, ZHANG Kaihong615-618,663
Research on the Reliability Analysis Method of Electric Connector by Fusion Failure Physics and 3F MethodGAO Cheng, WANG Changxin, HUANG Jiaoying634-639
Discussion on the Calibration Method of Scanning Electron Microscope Based on Line Distance Standard SamplesZHAO Lin, ZHANG Xiaodong, LI Suoyin, HAN Zhiguo, WU Aihua644-648
Research of Calibration Device for Testing During Burn In Equipment of Integrated CircuitsSUN Chongjun, QIU Ping649-653
Reliability Analysis of IGBT Considering Power CyclingZENG Dingjun, CUI Naidong, LIU Wei, DENG Huan654-658
Research on the Performance of Automobile Industrial Components for Low Temperature OperationXU Yanjun, LI Zhi, YAN Yubo659-663
