Constructal design of tree-shaped high thermal conductivity channel in 3D electronic device based on minimum entransy dissipation rate
XI Xuetao
FENG Huijun
CHEN Lingen
GE Yanlin
Abstract：A tree-shaped high thermal conductivity channel model is established in 3D electronic devices.Based on the constructal theory,the tree-shaped high thermal conductivity channel is designed with the aim of minimizing the non-dimensional entransy dissipation rate under the condition of a certain total volume,and the constructal optimization results under different parameters are compared.The results show that with the increase of the thickness of the high thermal conductivity channel,the dimensionless entransy dissipation rate decreases first and then increases.When the thickness is 32 μm,the minimum value of dimensionless entransy dissipation rate is 0.779,which is 22.11%lower than the initial value.When the thickness of the high thermal conductivity channel is 29 μm and the width of the secondary high thermal conductivity channel is 1 500 μm,the dimensionless entransy dissipation rate of the three-dimensional electronic device reaches the double minimum value of 0.743,which is 25.7%lower than the initial value.Under the optimal construct,the dimensionless entransy dissipation rate of the model without the tree-shaped high thermal conductivity channel is 5.084,while that of the model with the tree-shaped high thermal conductivity channel is only 0.473,which is 90.69%lower than that of the former.Therefore,the heat dissipation performance of three-dimensional electronic devices is significantly increased after using the tree-shaped high thermal conductivity channel.The research can provide a reference for the design of three-dimensional electronic devices based on high thermal conductivity channels.
Keywords：constructal theory3D electronic devicetree-shaped high thermal conductivity channelgeneralized thermodynamic optimization
Publication Date：2025-03-25
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：6( 55-60 )