Effect of non-uniform distributed high thermal conductivity material on constructal entransy dissipation rate minimization of a rectangular assembly

TANG Chuang; CHEN Lin-gen; FENG Hui-jun; GE Yan-lin

doi:10.3969/j.issn.1004-7948.2023.06.010

Home>Articles>Effect of non-uniform distributed high thermal conductivity material on constructal entransy dissipation rate minimization of a rectangular assembly

DOI: 10.3969/j.issn.1004-7948.2023.06.010

Effect of non-uniform distributed high thermal conductivity material on constructal entransy dissipation rate minimization of a rectangular assembly

TANG Chuang

CHEN Lin-gen

FENG Hui-jun

GE Yan-lin

Keywords：constructal theoryentransy theoryheat conduction constructal optimizationrectangular assemblynon-uniform distributed high conductivity material

Publication Date：2023-06-15

Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)

Pages：6( 34-39 )

Energy Conservation

ISSN：1004-7948

Year, Vol.(Issue)：2023,42(6)