Design Optimization and Testing of the Thermopile-type High-temperature Heat Flux Sensor
LI Xiaofen
ZHANG Lei
ZHANG Xiangxiang
TAN Qiulin
Abstract：Based on the Seebeck effect and Fourier's law,two different structures of thermopile-type high-temperature heat flux sensors are designed,and the sensors are physically prepared on 10×10 mm2 square and 10 mm diameter circular Al2O3 ceramic substrates,respectively.Two kinds of thermopile structures,serpentine and annular,are prepared by screen-printing process,and high-pressure spraying is used to make step-distributed and centralized thermal resistance layers correspondingly,and the two kinds of heat flux sensors are tested and compared.The results show that the peak voltage of the circular heat flux sensor is 0.223 2 mV,which is higher than that of the square heat flux sensor of 0.164 1 mV,and the circular heat flux sensor has a better perfor-mance.In a heat flux environment of 48.8 kW/m2～193.2 kW/m2,the output voltage of the circular heat flux sensor reaches 0.225 6 mV,with a sensitivity of 1.34 μV/(kW/m2),a repeatability error of less than 2.34％,and a stable output performance,which pro-vides a solution for the difficult problem of surface heat flux monitoring of miniature,high-temperature components.
Keywords：Seebeck effectscreen printinghigh-pressure sprayingthermopilesheat flux sensors
Publication Date：2025-12-20
Online Publishing Date：2026-03-23(First online date of this platform, not the publication date of the document)
Pages：5( 231-235 )