Failure Analysis of MEMS Inverted Pressure Sensor
DANG Weigang
WANG Rui
LIU Dong
LIANG Ting
LEI Cheng
Abstract：In response to the problems encountered during the testing process of MEMS inverted pressure sensors,this paper analyzes the correlation between pressure sensor faults and chip design,chip preparation,and integrated sensor packaging,provid-ing reference for preventive maintenance and failure analysis of pressure sensors.This article selects sensor chips successfully re-searched by the research group from 2021 to 2022,and packages them into integrated sensors.This paper analyzies the problems that occurred during testing and repairs their faults.The results show that the metal point electrodes in the glass through-hole of the inverted pressure sensor are warped after long-term operation,forming a fault with the surrounding sputtered metal and causing a circuit breaker.The through-hole is repaired by filling it with conductive slurry,and the repaired sensor's lifespan is greatly extend-ed under working conditions.This article proposes a complete failure analysis process for an inverted pressure sensor,and effective-ly analyzes the fault distribution and reliability of the sensor,providing a reference for developing targeted preventive maintenance plans.
Keywords：inverted pressure sensorfaultfailure analysisproblem fixingrepair testing
Publication Date：2025-11-20
Online Publishing Date：2026-01-28(First online date of this platform, not the publication date of the document)
Pages：5( 157-161 )