Multi-physical Field Simulation of Electromigration of Daisy-chain Interconnect
LI Xueru
HOU Wen
WANG Junqing
ZHANG Haikun
LI Mengwei
Keywords：daisy-chain interconnectelectrical-thermal couplingelectrical migration reliabilityfinite element analysis
Publication Date：2023-04-20
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：4( 78-81 )