Preparing Phenol-formaldehyde Resin Adhesive from Waste Printed Circuit Boards
Keywords:orthogonal experimentwaste printed circuit boardsphenol-formaldehyde resin adhesivebond strength
Publication Date:2010-01-01
Online Publishing Date:2025-08-15(First online date of this platform, not the publication date of the document)
Pages:5( 59-62,116 )
ENVIRONMENTAL SCIENCE & TECHNOLOGY

ENVIRONMENTAL SCIENCE & TECHNOLOGY

PKUISTIC
ISSN:1003-6504
Year, Vol.(Issue):2010,33(5)