The study on solution to problems caused by matching different thermal expansion materials
CHENG Nian-bin
Abstract：Based on lighting LED panel lamp products, the problem of material thermal expansion characteristics and structure coordination is derived from the perspective of product design and technology under the contradiction between the increasing performance improvement requirements of customers and the pursuit of low cost. By means of large amount of experimental data, a Raise-up model is established, the reason of warpage is analyzed in combination with the thermal expansion characteristics of the material, and the problem of warpage is solved by adjusting the structure design so as to alleviate the contradiction between the requirement of customers for performance improvement and the pursuit of low-cost advantages.
Keywords：panel lightthermal expansionraise-up
Publication Date：2018-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：5( 37-41 )