The Simulation Analasys of Telephone Shell Based on Moldflow
LIU Ling
LAI Yan-ling
Abstract：In order to improve the efficiency of mold design, reduce costs of mold manufacturing, we used Moldflow MPI 6 to the telephone shell flow cooling and warpage analysis, which was taken as the research object, obtained the best gate location, the filling time, cooling water temperature, warpage analysis results, according to the results of analysis ,we can get valuable advice for die design work, and design a reliable mold.
Keywords：coolingwrapMoldflowtelephone shell
Publication Date：2013-01-01
Online Publishing Date：2025-08-15(First online date of this platform, not the publication date of the document)
Pages：3( 10-12 )